IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
The many changes that have occurred in array packaging since the standard's last revision are also addressed in the E revision, as are changes to hot tear and fillet lifting.
There are new sections on depanelization, board in board, package on package, and flex attachment.
3 sessions starting March 11, 2013, ending March 13, 2013
You must register for this class at www.cnm.edu/wtc or call (505) 224-5200.